this is information on a product in full production. may 2013 doc id024678 rev 1 1/8 8 BAL-CW1250D3 balun transformer with integrate matching datasheet ? production data features ? 50 ? nominal input / match st-ericsson rf ic cw1250, cw1150, cw1260 ? low insertion loss ? low amplitude imbalance ? low phase imbalance ? dc blocking access on single rf input ? small footprint: < 1.2 mm 2 benefits ? extremely low profile (< 550 m after reflow) ? integrate matching network ? high rf performances ? rf components count and area reduction applications ? balun with integrated matching for st-ericsson rf ic cw1250, c1150, cw1260 description stmicroelectronics BAL-CW1250D3 is a balun (balanced/unbalanced device) designed to transform a single ended signal to differential signals in wlan application.this BAL-CW1250D3, with low insertion losses in the brandwidth 2400 mhz to 2500 mhz, has been customized for cw1250, cw1150, cw1260 tranceiver.the differential output embeds an integrated matching network adapted to the transceiver. the BAL-CW1250D3 has been designed using stmicroelectronics ipd (integrated passive device) technology on non-conductive glass substrate to optimize rf performances. figure 1. pinout diagram (top view) lead-free flip-chip package 5 bumps a b c 3 2 1 se gnd vcc diff diff www.st.com
characteristics BAL-CW1250D3 2/8 doc id024678 rev 1 1 characteristics table 1. absolute maximum ratings (limiting values) symbol parameter value unit min typ max p in average power rf in 24 dbm v esd esd ratings mil std883c (hbm: c = 100 pf, r = 1.5 k ? , air discharge) 2000 v esd ratings charged device model (jesd22-c101-d) 500 esd ratings machine model (mm: c = 200 pf, r = 25 ? , l = 500 nh) 200 t op operating temperature -30 to +85 c table 2. impedances (t amb = 25 c) symbol parameter value unit min typ max z out nominal differential output impedance matched ? z in nominal input impedance 50 ? table 3. rf performance (t amb = 25 c) symbol parameter value unit min typ max f frequency range (bandwidth) 2400 2500 mhz il insertion loss in bandwidth 0.97 db rl se single ended return loss in bandwidth -21 db rl diff differential return loss in bandwidth -24 db ? imb phase imbalance -10 10 aimb amplitude imbalance -1 0.1 1 db att 2f0 2nd harmonic attenuation -19 db
doc id024678 rev 1 3/8 BAL-CW1250D3 characteristics figure 2. insertion loss figure 3. single ended return loss s21 (db) f (ghz) -0.90 -0.92 -0.94 -0.96 -0.98 -1.0 2.40 2.44 2.47 2.49 2.50 2.41 2.42 2.43 2.45 2.46 2.48 f (ghz) -30 2.40 2.44 2.47 2.49 2.50 2.41 2.42 2.43 2.45 2.46 2.48 s11 (db) -20 -22 -24 -26 -28 figure 4. differential return loss figure 5. amplitude imbalance f (ghz) -34 -40 2.40 2.44 2.47 2.49 2.50 2.41 2.42 2.43 2.45 2.46 2.48 s22 (db) -24 -26 -28 -30 -36 -32 -38 f (ghz) -0.32 -0.29 2.40 2.44 2.47 2.49 2.50 2.41 2.42 2.43 2.45 2.46 2.48 absolute aimb (db) -0.37 -0.36 -0.35 -0.34 -0.31 -0.33 -0.30 figure 6. phase imbalance figure 7. second harmonic attenuation f (ghz) 2.52 2.46 2.40 2.44 2.47 2.49 2.50 2.41 2.42 2.43 2.45 2.46 2.48 absolute phimb (deg) 2.62 2.60 2.58 2.56 2.50 2.54 2.48 s21 (db) f (ghz) -18.5 -19.0 -19.5 -20.0 -20.5 -21.0 2.40 2.44 2.47 2.49 2.50 2.41 2.42 2.43 2.45 2.46 2.48
application information BAL-CW1250D3 4/8 doc id024678 rev 1 2 application information figure 8. application schematic pa 2.4ghz pa 5ghz lna 2.4ghz lna 5ghz z f BAL-CW1250D3 bpf 2.4ghz bpf50-01d3 2.4g/5g rf transceiver bluetooth rx/tx 5ghz fem 2.4ghz fem dip2450-01d3
doc id024678 rev 1 5/8 BAL-CW1250D3 package information 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 9. flip-chip package di mensions (top and side view) figure 10. footprint figure 11. marking se diff p v cc gnd diff n 380 m 1.20 mm 50 m 0.99 mm 50m 380 m 630 m 400 m copper pad diameter: 220 m recommended 260 m maximum solder stencil opening: 220 m recommended solder mask opening: 300 m minimum
package information BAL-CW1250D3 6/8 doc id024678 rev 1 figure 12. recommended land pattern (used for balun characterization) figure 13. flip chip tape and reel specifications note: more information is availa ble in the application notes: an2348 flip-chip package descript ion and recommendations for use dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.50 0.71 0.05 1.09 0.05 0.22 1.30 0.05 st st st xxz xxz xxz yww yww yww
doc id024678 rev 1 7/8 BAL-CW1250D3 ordering information 4 ordering information 5 revision history table 4. ordering information part number marking package weight base qty delivery mode BAL-CW1250D3 sg flip chip 1.46 mg 5000 tape and reel(7?) table 5. document revision history date revision changes 23-may-2013 1 initial release.
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